EV Group Highlights Hybrid Bonding, Layer Transfer and Lithography Technologies for Heterogeneous Integration and Device Scaling at SEMICON West 2026

ST. FLORIAN, Austria, September 29, 2026—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that its experts will be available to discuss EVG’s latest solutions for heterogeneous integration and device scaling at SEMICON West, the premier microelectronics exhibition in North America, to be held on October 13-15 in San Francisco, Calif. EVG’s process solutions address key manufacturing challenges associated with increasingly complex device architectures and integration approaches, including high-bandwidth memory (HBM), complementary field-effect transistors (CFETs), co-packaged optics (CPO), 3D/chiplet integration and other advanced packaging applications. 

“As semiconductor device architectures become more complex and increasingly integrated, manufacturers are facing new challenges that cannot be addressed through isolated solutions,” stated Hermann Waltl, executive sales and customer support director at EV Group. “EVG provides the breadth of process expertise and manufacturing capabilities needed to address these challenges across advanced packaging, heterogeneous integration, and next-generation device scaling. By applying our solutions and know-how across these different areas, we help customers turn these emerging integration opportunities into manufacturable processes for future semiconductor devices.”

Supporting High-Yield Hybrid Bonding for Advanced Memory and 3D Integration

Wafer-to-wafer (W2W) hybrid bonding is critical for enabling high-yield, scalable manufacturing of next-generation 3D NAND and DRAM, which demand sub-micron alignment accuracy and excellent bond strength. Die-to-wafer (D2W) hybrid bonding is an important enabler of chiplet integration, HBM stacks, and 3D system-on-chip (SoC) integration processes. 

EVG provides a complete hybrid bonding process flow for W2W bonding, including the GEMINI^® FB automated production wafer bonding system for high-volume hybrid and fusion wafer bonding. imec and EVG recently demonstrated a highly yielding W2W hybrid bonding process at 200-nm copper interconnect pitch, achieving sub-40-nm post-bond overlay accuracy across 100 percent of dies on a 
300-mm wafer, using a GEMINI FB system. EVG also provides comprehensive support for D2W hybrid bonding, including surface preparation, cleaning, and collective die transfer with the EVG^®320 D2W, and high-resolution die-to-wafer overlay measurements at the highest throughput with the EVG^®40 D2W. 

Comprehensive Process Expertise for CPO Manufacturing

EVG’s process portfolio addresses numerous critical manufacturing requirements across the CPO ecosystem. The GEMINI FB enables high-density, low-parasitic integration of photonic integrated circuits (PICs) and electronic integrated circuits (EICs), while the EVG320 D2W supports heterogeneous integration of III-V semiconductor materials for laser fabrication and emerging modulation materials. EVG’s ComBond^® automated high-vacuum wafer bonding system ensures low-loss, optically transparent interfaces and integration of heat spreader materials such as diamond and silicon carbide (SiC), while the EVG^®850 TB/DB supports wafer thinning for laser diode fabrication and ultra-thin ASIC die stacking. The HERCULES^® NIL fully integrated SmartNIL^® UV-NIL system provides a scalable manufacturing approach for optical coupling and beam-shaping elements used in chip-to-chip and chip-to-fiber optical interconnects.

Digital Lithography for Advanced Packaging Applications

EVG’s LITHOSCALE^® XT system with MLE™ (maskless exposure) technology combines high-resolution, stitch-free patterning with high throughput for advanced packaging and MEMS applications, including fan-out wafer-level packaging (FOWLP) for AI and HPC devices, fine-pitch wafer probe cards, advanced imaging sensors, and die traceability for security and automotive applications. Its real-time wafer-level distortion and die-shift compensation provides improved die-placement accuracy and patterning yield for bowed or warped wafers, such as those used in FOWLP, without impacting throughput.

Enabling Thin-Die Stacks with IR LayerRelease™

EVG’s IR LayerRelease technology is a fully front-end-compatible layer transfer technology that uses an infrared laser in combination with specially formulated inorganic release layers to enable laser-initiated release of ultra-thin films and layers from silicon carriers with nanometer precision and high throughput. The technology enables the use of silicon wafer carriers instead of glass carriers in advanced packaging processes such as FOWLP and interposer-based 3D integration. At the same time, its compatibility with high-temperature processes enables novel process flows for 3D-IC and 3D sequential integration, including hybrid and fusion bonding of ultra-thin layers on silicon carriers for next-generation transistor designs.

Hear from EVG’s Process Experts

At the Advanced Packaging & Heterogeneous Integration Summit during SEMICON West, Vineeth Reddy Bijjam, director of technology and IP, will present “Accelerating 3D Heterogeneous Integration with Advanced Bonding, Lithography and Metrology” during the Metrology & Inspection: The Gatekeepers of Yield in Advanced Packaging session on Tue., October 13, 2:30-2:50 pm in Room 156, South Hall, Upper Mezzanine, Moscone Center.

To speak with an EVG expert and learn more about the company’s industry-leading solutions for heterogeneous integration and device scaling, visit EVG’s booth 2039 (South Hall) during exhibition hours.

About EV Group (EVG)

EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vision of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.