Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
By Nitin Dahad, EETimes (October 22, 2024)
The 2024 Open Compute Project Foundation (OCP) Global Summit drew some 7,000 visitors, and its success was apparent at registration: long lines of people trying to get their badges, no nearby parking if you were coming by car, and a packed show floor keen to learn about the latest initiatives from OCP members and exhibitors.
The main opening announcement from OCP was the expansion of its “Open Systems for AI Strategic Initiative,” with contributions from Nvidia with its MGX-based GB200-NVL72 platform and “in-progress contributions” from Meta. This specific community effort was launched in January 2024, with leadership provided by Intel, Microsoft, Google, Meta, NVIDIA, AMD, ARM, Ampere, Samsung, Seagate, SuperMicro, Dell, and Broadcom, with the objective being to establish commonalities and develop open standardizations for AI clusters and the data center facilities that host them.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Eliyan Showcases Next-Generation Chiplet Interconnect and Memory Innovations at OCP Global Summit 2025
- SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Credo to Exhibit at Chiplet Summit 2025
Latest News
- Ayar Labs Closes $500M Series E, Accelerates Volume Production of Co-Packaged Optics
- NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
- GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- GLS and APES Announce Advanced Semiconductor Packaging Partnership
- Ayar Labs Names Sankara Venkateswaran as Vice President of Engineering