Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
By Nitin Dahad, EETimes (October 22, 2024)
The 2024 Open Compute Project Foundation (OCP) Global Summit drew some 7,000 visitors, and its success was apparent at registration: long lines of people trying to get their badges, no nearby parking if you were coming by car, and a packed show floor keen to learn about the latest initiatives from OCP members and exhibitors.
The main opening announcement from OCP was the expansion of its “Open Systems for AI Strategic Initiative,” with contributions from Nvidia with its MGX-based GB200-NVL72 platform and “in-progress contributions” from Meta. This specific community effort was launched in January 2024, with leadership provided by Intel, Microsoft, Google, Meta, NVIDIA, AMD, ARM, Ampere, Samsung, Seagate, SuperMicro, Dell, and Broadcom, with the objective being to establish commonalities and develop open standardizations for AI clusters and the data center facilities that host them.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Eliyan Showcases Next-Generation Chiplet Interconnect and Memory Innovations at OCP Global Summit 2025
- SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
- InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem
- Chiplet Summit 2026 to Spotlight AI Acceleration and Advanced Packaging
Latest News
- SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
- OpenLight Adds Former GlobalFoundries Silicon Photonics Leader Kevin Soukup and Semiconductor Veteran Kirk Ouellette to Executive Team
- Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026
- AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028
- onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era