Alphawave Semi brings High-Speed Connectivity and Compute Solutions at OFC 2025

Showcasing new technologies, for 224G XLR SerDes, 1.6T Multi-Standard I/O Chiplets, UCIe D2D for Optical Chiplets, and 800G/1.6T PAM4 & Coherent-lite DSPs

LONDON, United Kingdom, and TORONTO, Canada – April 1, 2025 - Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, is thrilled to participate in this year's Optical Fiber Communications Conference & Exhibition (OFC). Celebrating OFC's 50th anniversary, Alphawave Semi will showcase a broad array of advanced data connectivity solutions for AI, compute and network architectures and engage in technical speaking sessions and collaborative technology demonstrations with partners.

Alphawave Semi will showcase groundbreaking innovations through the following live demonstrations:

• 224G PAM4 Electrical SerDes:
  • 224G XLR IP subsystem solutions unlocking the next generation in connectivity.
• 1.6T I/O Chiplets:
  • Chiplet technologies that are silicon ready, with solutions for PCle and Ethernet linking up in the multi-vendor interoperability demonstration at 112G.
• UCIe D2D IP Subsystem:  
  • Delivering ultra-high speeds in silicon proven advanced packaging to enable optical I/O chiplet designs across many package types. Also supports silicon proven standard organic packaging.
  • Paving the way to 64G: UCIe: Discover how our Gen3 64 Gbps UCIe IP delivers high-speed connectivity with a bandwidth density exceeding 20 Tbps/mm, all while maintaining ultra-low power usage and minimal latency.
• Optical PCIe Subsystem:
  • Interoperability over optics with a Test & Measurement Golden Reference Link Partner.

Alphawave Semi’s full portfolio of standard connectivity products is enabling high-speed communications over electrical and optical connections across distances of up to 20 km. The announcement that came last week (link here) emphasizes how it leverages Alphawave Semi’s cutting-edge PAM4 SerDes, along with its differentiated WidEye™ DSP architecture and EyeQ™ advanced diagnostics technology, to meet the needs of leading hyperscalers and their buildout of accelerated AI compute infrastructure.

• Cu-WaveTM PAM4 DSP for Active Electrical Cables (AEC)  
• O-WaveTM PAM4 DSP for Optical Retimer and Gearbox Transceivers  

• Co-WaveTM Coherent-Lite DSP for Optical Transceiver

Collaborations in die-to-die connectivity paving the way for 64G UCIe and a future of optical chiplets built on Alphawave Semi’s IP will also be found in partner booths of Ayar Labs (booth #2958, #3533), Keysight Technologies (Booth #1301, #6562), and the UCIe Consortium Kiosk (booth #2958). Low latency, robust PCIe connectivity solutions will also be found in partner booths of Luxshare (booth #4905), MACOM (booth # 2028), and Terahop (booth # 2429).

Alphawave Semi will be involved in panels on optical communications and chiplets. Tony Chan Carusone will present "Unleashing AI's Potential with Advanced Chiplet Solutions" on April 3rd from 9:15 AM to 9:45 AM at Theater II. OFC takes place at the Moscone Center in San Francisco, CA between March 30 and April 3. Alphawave Semi’s PAM4 and Coherent-lite DSPs will be previewed for the first time at its booth (#5645).

For more information on Alphawave Semi’s Connectivity Products Group visit awavesemi.com/connectivity-products.

Read More News from our partners at the OFC 2025:

• Ayar Labs Unveils World’s First UCIe Optical Chiplet for AI Scale-Up Architectures
• OIF Advances Interoperability at OFC 2025 with Live Demos, Expert Insights and Cross-Industry Collaboration
• Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI

About Alphawave Semi

Alphawave Semi is a global leader in high-speed connectivity and compute silicon for data centers, AI, networking, 5G, autonomous vehicles and storage.

Our technology enables data centers and the world’s technology infrastructure to manage the exponential growth of data and prevent networking bottlenecks, with increasing volumes of data traveling faster, more reliably, and with higher performance at lower power. We are a leader in the shift to chiplet-based System-on-Chip (SoC) architectures and our intellectual property (IP), custom silicon, connectivity products and chiplets are deployed by global tier-one customers across multiple sectors.