Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
By Ed Sperling And Laura Peters - Semiconductor Engineering (January 29th, 2025)
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
- SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
Latest News
- Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
- HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem
- EdgeCortix Signs Multi-Year, Multimillion-Dollar Agreement with Kawasaki Heavy Industries to Advance Next-Generation AI-Enabled Aerial Defense Systems
- Crealights and GlobalFoundries Deepen Global Strategic Partnership
- Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects