Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
By Ed Sperling And Laura Peters - Semiconductor Engineering (January 29th, 2025)
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
Latest News
- Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
- Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- TYLsemi De-Risks Chiplets With New Business Model
- Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging