Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers
PLAINVIEW, N.Y., May 07, 2025 -- Veeco Instruments Inc. (NASDAQ: VECO) today announced its received over $35 million of orders for its AP300™ Lithography systems in recent quarters from a wide-range of IDM and OSAT customers. The orders are expected to be delivered in 2025, and are supporting capacity expansions driven by several end markets, including AI and high-performance computing. Veeco’s Advanced Packaging Lithography business is expected to deliver strong year-over-year growth in 2025.
Veeco’s AP300™ Lithography systems offer industry-leading performance specifically designed for Advanced Packaging applications, lower total cost of ownership, industry-leading uptime, and process flexibility. Recent orders highlight accelerating market demand for Veeco’s lithography systems given the tools’ ability to handle next generation advanced packaging process needs, such as copper (Cu) pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP (FOWLP) and high-density fan-out packaging.
“Global megatrends such as AI and high-performance computing are driving strong demand for enabling technologies in advanced packaging,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Customers require a lithography platform that can handle a wide range of advanced packaging process needs with best-in-class process capabilities and low cost of ownership. Our AP300 platform is distinguished as a solution that sets the industry standard for challenging advanced packaging processes required for high-performance, next-generation devices.”
About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, single wafer etch & clean, lithography, and metal organic chemical vapor deposition (MOCVD) technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- Global Semiconductor IDM Qualifies Veeco Wet Processing Platform for Two New Applications in Advanced Packaging
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
- EV Group Highlights Hybrid Bonding, Layer Transfer and Maskless Lithography Technologies for Heterogeneous Integration and Advanced Packaging at ECTC 2026
Latest News
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
- Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence