Shin-Etsu Chemical - Chiplet Ecosystem

Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture semiconductor package substrates with a new manufacturing method subsequently to manufacturing micro-LED manufacturing system. The equipment is a high-performance processing equipment using excimer laser in which a dual damascene method, as is also used in the front end of semi-conductor manufacturing process, is applied to package substrate manufacturing process (back end process) (Shin-Etsu dual damascene method). As a result, an interposer’s functions directly formed into a package substrate. This not only eliminates the need of an interposer, but also enables further microfabrication, where conventional manufacturing methods could not realize. It also reduces costs and capital investment as it does not require the photoresist process in package substrate manufacturing process.