AI CPU Chiplets

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2 Chiplet (1 - 2)

Ncore Multi-Die Interconnect IP
- Scale Performance with Multi-Die Coherency
- Increase Bandwidth and Reduce Latency
- Tune Systems for Flexibility and Design Requirements
Hub Chiplet
- Rich pluggable SoC infrastructure that can help accelerators and CXL solutions reach the market 5x-10x faster with over 10x cost reduction