UCIe™ Consortium - Chiplet Ecosystem

UCIe™ — Universal Chiplet Interconnect Express™ — addresses customer requests for a more customizable, package-level integration — combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem.

This new open industry standard establishes a universal interconnect at the package-level.

What's New

A Deep Dive into UCIe-3D

UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation

Introducing the UCIe 2.0 Specification Supporting 3D Packaging and Manageability System Architecture

The UCIe 1.1 Specification: Our Journey Toward Building an Open Ecosystem of Chiplets

UCIe Consortium Releases 2.0 Specification Supporting Manageability System Architecture and 3D Packaging

Exploring the Advancement of Chiplet Technology and the Ecosystem

Introduction to UCIe Tutorial: Electrical, Form Factor, and Compliance

Exploring the Advancement of Chiplet Technology and the Ecosystem

The UCIe™ 1.1 Specification: Future Applications of Chiplets

UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Corporate Headquarters

UCIe™ Consortium
3855 SW 153rd Drive
Beaverton, OR 97003
USA