UCIe™ Consortium - Chiplet Ecosystem

UCIe™ — Universal Chiplet Interconnect Express™ — addresses customer requests for a more customizable, package-level integration — combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem. 

This new open industry standard establishes a universal interconnect at the package-level.

Corporate Headquarters

UCIe™ Consortium
3855 SW 153rd Drive
Beaverton, OR 97003
USA

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