The UCIe™ 1.1 Specification: Future Applications of Chiplets
The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models.
This webinar provides an overview of enhancements made in the UCIe 1.1 specification and architectural specification attributes to define system setups and registers used in test plans and compliance testing to ensure device interoperability.
The presentation will also explore additional enhancements for automotive usages – such as predictive failure analysis and health monitoring – and enabling lower-cost packaging implementations.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
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- High-performance connectivity chiplets
- eFPGA Chiplet
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