UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation
By Debendra Das Sharma, UCIe Consortium Chairman
UCIe™ (Universal Chiplet Interconnect Express™) is an open industry that defines the interconnect offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets.
The UCIe 1.1 Specification delivers valuable improvements that extend reliability mechanisms, provide enhancements for the automotive industry, enable lower-cost implementations, and establish compliance and interoperability testing specifications to establish a vibrant chiplet ecosystem.
During this presentation, Debendra Das Sharma, UCIe Consortium Chairman, will provide an update on the UCIe Consortium and highlight progress in the specification.
Related Videos
- Introducing the UCIe 2.0 Specification Supporting 3D Packaging and Manageability System Architecture
- The UCIe 1.1 Specification: Our Journey Toward Building an Open Ecosystem of Chiplets
- The UCIe™ 1.1 Specification: Future Applications of Chiplets
- Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)
Latest Videos
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
- UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation
- Accelerating AI Innovation with Arm Total Design: A Case Study
- The Rise of The Hublet™ & FPGA Chiplets
- From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology