Multibeam Corp. - Chiplet Ecosystem
Multibeam helps semiconductor leaders accelerate chip innovation with the industry’s first Multicolumn E-Beam Lithography (MEBL) system built for volume production. The technology provides large Field of View (FoV), deep Depth of Focus (DoF), and the ability to write unique patterns without masks. Applications include rapid prototyping, next-generation advanced packaging and heterogeneous integration, chip ID and traceability, high-mix quick-turn manufacturing, high-performance compound semiconductors, high-efficiency silicon photonics, 3D MEMS structures, and more.
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Multibeam Corp.