Moving Data at the Speed of AI
Ayar Labs is unveiling the second generation of SuperNova, which powers the company’s TeraPHY optical I/O chiplet and enables huge leaps in bi-directional bandwidth. Mark Wade, CEO and Co-founder from Ayar Labs, discusses:
- The unveiling of Ayar Labs' latest hardware, achieving full bandwidth between two chips of 4 terabits per second.
- The power of this technology to transmit massive amounts of bandwidth with low latency, high bandwidth densities, and excellent power efficiency, all while maintaining signal integrity.
- The ongoing ecosystem work, including optically connected FPGAs with Intel PSG (Altera), high-density optical connector work with Teramount, and the management of optical connections with Corning around glass interposers and optical interposers with glass shuffles.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- The future of AI: Chiplets & Lasers
- Chiplets for the future of AI
- Connectivity for AI Everywhere: The Role of Chiplets
Latest Videos
- Optical Connectivity At 224 Gbps
- Proximity is all You Need – Two Tricks for Chiplet Interconnects
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
- Mick Posner talks about the importance of UCIe
- Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP