Connectivity for AI Everywhere: The Role of Chiplets

By Tony Chan Carusone, CTO, Alphawave Semi

 

Chiplet technology is set to be a transformational paradigm. It offers compelling advantages in cost, time-to-market, and power consumption. AI has emerged as a primary catalyst for this trend because the only way to meet the accelerated demands of AI is by using chiplets.  By combining dense logic, memory, and high-speed connectivity chiplets, new silicon systems tailored to specific workloads can be created without starting from scratch each time.  As chiplet adoption increases, so do the bandwidth demands both within the package across die-to-die interfaces, and beyond the package. Low-latency inter-die communication is crucial for compute performance, and high-speed optical interconnects are vital for scaling AI clusters.