Connectivity for AI Everywhere: The Role of Chiplets
By Tony Chan Carusone, CTO, Alphawave Semi
Chiplet technology is set to be a transformational paradigm. It offers compelling advantages in cost, time-to-market, and power consumption. AI has emerged as a primary catalyst for this trend because the only way to meet the accelerated demands of AI is by using chiplets. By combining dense logic, memory, and high-speed connectivity chiplets, new silicon systems tailored to specific workloads can be created without starting from scratch each time. As chiplet adoption increases, so do the bandwidth demands both within the package across die-to-die interfaces, and beyond the package. Low-latency inter-die communication is crucial for compute performance, and high-speed optical interconnects are vital for scaling AI clusters.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Chiplets for the future of AI
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- The future of AI: Chiplets & Lasers
- Photonic Fabric Interface Chiplets for AI XPU Optical Connectivity
Latest Videos
- Chiplet Package that Balances High Performance and Low Power Consumption
- The Architecture of "Open" Intelligence
- OCP Summit 2025: Eddie Ramirez, Arm on Leveraging Chiplets For AI Infra
- Standardizing the Chiplet Era: Inside Look at Arm's Chiplet Ecosystem
- Applied Materials’ Kinex™ Integrated Hybrid Bonding System