Testing For Thermal Issues Becomes More Difficult
By Gregory Haley, SemiEngineering (December 10, 2024)
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
In the past, thermal effects were largely an afterthought for test engineers. Devices operating at higher frequencies or employing materials like silicon-germanium (SiGe), gallium nitride (GaN), or silicon carbide (SiC) have distinct thermal behaviors at the chip level. That’s not the case for heterogeneous stacks of chiplets. In fact, each chiplet may have different power and thermal characteristics.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Chiplets Make Case for More Apps
- Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
- Arm bids for chiplet dominance
- Arm CSA and AMBA release provide boost for chiplet ecosystem
Latest News
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line
- EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
- Cadence Rolls Out System Chiplet to Reorganize the SoC