Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
By Francoise von Trapp, 3DInCites (Dec 03, 2024)
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024 was a good place to do that. And our community members were there to lend a hand.
Many presentations offered historical overviews of advanced packaging. So wherever you are in your understanding of advanced packaging, the context was provided to catch you up to where we are today. If you missed the APC this year, you might want to check it out next year. Unfortunately, I didn’t catch the entire line-up, but here are highlights from the morning session.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Advanced packaging revenue dropped 9% in Q1 2024, but recovery is expected in 2024
- CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
Latest News
- Athos Silicon Chief mSoC™ Architect Francois Piednoel to Present the IEEE World Technology Summit 2025 in Berlin
- Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs
- Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
- Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
- NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium