Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
By Francoise von Trapp, 3DInCites (Dec 03, 2024)
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024 was a good place to do that. And our community members were there to lend a hand.
Many presentations offered historical overviews of advanced packaging. So wherever you are in your understanding of advanced packaging, the context was provided to catch you up to where we are today. If you missed the APC this year, you might want to check it out next year. Unfortunately, I didn’t catch the entire line-up, but here are highlights from the morning session.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Advanced packaging revenue dropped 9% in Q1 2024, but recovery is expected in 2024
- CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
Latest News
- IEEE Study Achieves Efficient Integration of Quantum Dot Lasers on Silicon Chiplets
- Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Infinitesima Metron®3D 300mm System Released for In-line Process Control by Leading DRAM Manufacturer
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree