Report: SK Hynix mulls offering advance packaging foundry service
By Peter Clarke, eeNews Europe ( December 16, 2024)
Memory chip vendor SK Hynix is considering a move into 2.5D chip packaging as a foundry outsource operation, according to South Korea’s ETnews.
The move may be partially driven by SK Hynix’s sub-ordinate role to foundry TSMC in the creation of AI accelerators for Nvidia. If SK Hynix could offer 2.5D packaging skills it could potentially offer to work in parallel with TSMC and perform the integration of GPU die and high-bandwidth memory (HBM) DRAM components in AI acceleration components.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
- SKC invests in Chipletz, a rising star of the U.S. chip packaging industry
- JCET’s Automotive Chip Advanced Packaging Flagship Factory Project Gains Momentum
Latest News
- Three-Way Race To 3D-ICs
- Promex Industries Expands Best-in-Class Capabilities, Installing Laser Depaneling and Advanced SPI Systems on Manufacturing Line
- Cyber Threats Multiply With Commercial Chiplets
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- Intel Foundry Gathers Customers and Partners, Outlines Priorities