Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging (FOWLP) is an advanced semiconductor packaging technology designed to deliver high performance, ultra-thin profiles, excellent thermal efficiency, and higher I/O density. It is widely used in smartphones, wearables, automotive electronics, and high-performance computing systems that demand compact size and strong electrical performance.

What Is Fan-Out Wafer-Level Packaging?

Fan-Out Wafer-Level Packaging is a wafer-level process where individual dies are embedded in a reconstituted wafer, allowing the electrical connections to expand (fan out) beyond the chip’s footprint.
This design eliminates the need for traditional substrates and wire bonding, resulting in thinner, faster, and more efficient semiconductor devices.

Related Articles

• Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
• Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
• 2D materials-based 3D integration for neuromorphic hardware
• Business Analysis of Chiplet-Based Systems and Technology

Related Blogs

• 3D-ICs in the Automotive Market: Breaking Barriers with AI-Driven EDA Tools
• Understanding Signal Integrity in Chiplet Design
• What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts

Related News

• Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
• EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT
• Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes
• Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
• ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities