Heterogeneous Integration

Heterogeneous Integration (HI) is the process of combining multiple types of chips, components, and technologies into a single advanced package to create a more powerful and efficient system. Instead of relying on one large monolithic chip, heterogeneous integration brings together different functions, materials, and manufacturing nodes—all tightly connected to work as one.

In simple terms, it’s like assembling a high-performance “tech puzzle” where each chiplet or component does what it’s best at, resulting in a smarter, faster, and more energy-efficient device.

Related Articles

• LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration
• A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration
• Heterogeneous Integration Brings Compound Semiconductors into the Age of RF CMOS
• Taking 3D IC Heterogeneous Integration Mainstream
• Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators

Related Blogs

• UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration
• Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
• Accelerating the AI Economy through Heterogeneous Integration
• Heterogeneous Integration: The future of semiconductor technology
• Chiplets revolutionizing semiconductor design and integration

Related News

• OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
• Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications
• InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
• 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
• EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT