Chiplet Directory

Explore physical chiplets available across process nodes, interfaces, and packaging technologies, with a focus on integration readiness and maturity.

This directory grows alongside the chiplet ecosystem.
New chiplet profiles are added as vendors reach sufficient technical and integration readiness.

Chiplet vendors: submit your product profile when your solution becomes chiplet-ready.

New Chiplets

IMDD Tx PICs

  • Reliable & qualified
  • Supports single or dual input laser to drive all 8-channels
  • CMOS-level drive voltage, featuring our patented ultra-low drive voltage design
  • > 110 GHz electro-optic bandwidth
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Near-Packaged Optics (NPO) Chiplet Solution

  • CPO/NPO connectivity for GPU/Switch/ASIC with integrated OSPic™ all-optical signal processor
  • High capacity, low latency up to 10Tbps for scale out CPO
  • From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
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Interconnect Chiplet

  • Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
  • Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
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Automotive AI Accelerator

  • Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.
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100G optical I/O chiplets

  • RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
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