Explore physical chiplets available across process nodes, interfaces, and packaging technologies, with a focus on integration readiness and maturity.
This directory grows alongside the chiplet ecosystem .
New chiplet profiles are added as vendors reach sufficient technical and integration readiness.
Chiplet vendors : submit your product profile when your solution becomes chiplet-ready.
New
Chiplets
Reliable & qualified
Supports single or dual input laser to drive all 8-channels
CMOS-level drive voltage, featuring our patented ultra-low drive voltage design
> 110 GHz electro-optic bandwidth
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CPO/NPO connectivity for GPU/Switch/ASIC with integrated OSPic™ all-optical signal processor
High capacity, low latency up to 10Tbps for scale out CPO
From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
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UCIe based Ka/Ku band transceiver
Wide Bandwidth
Scalable solution for dense mm-wave radio into single multi-chip modules
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Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
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Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.
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Scalable AI, fortified with high compute density and ample memory bandwidth
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Parallel electrical interface
Supports AIB and other proprietary parallel interfaces
8 full-duplex optical ports
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2T2R chiplet configuration
160/175-GSa/s sample rate
7-bit resolution
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48-Gsps peak sample rate
8 bit resolution
UCIe SP (16x lanes at 16Gbps) with streaming controller
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12-Gsps peak sample rate
12 bit resolution (programmable)
UCIe SP (16x lanes at 16Gbps) with streaming controller
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RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
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