Co-Packaged Optics

Co-Packaged Optics (CPO) is an advanced technology that integrates optical components—such as lasers, photonics engines, and fiber connectors—directly next to electronic chips like switches or ASICs inside the same package. Instead of sending data through traditional copper connections, CPO uses optical signals, dramatically increasing bandwidth while reducing power consumption.

In simple terms, Co-Packaged Optics brings light-speed data transmission inside the chip package, enabling faster and more energy-efficient communication than ever before.

Related Articles

• Interfacing silicon photonics for high-density co-packaged optics
• Understanding In-Package Optical I/O Versus Co-Packaged Optics
• Understanding In-Package Optical I/O Versus Co-Packaged Optics

Related News

• Tower Semiconductor Announces New CPO Foundry Technology Available On Tower’s Leading Sipho and EIC Optical Platforms
• Ayar Labs Appoints Vivek Gupta as Chief Strategy Officer to Lead Hyperscaler Collaborations and Accelerate CPO Adoption
• JCET’s CPO Solution Accelerates Efficiency and Bandwidth Breakthroughs in Data Interconnect
• UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation Connectivity
• Avicena Advances microLED and Photo Detector Arrays to Enable the World’s Lowest-Power AI Scale-up Optical Interconnects