Advanced Packaging

Advanced Packaging refers to a set of next-generation semiconductor packaging technologies designed to improve chip performance, power efficiency, and integration beyond what traditional packaging can achieve. Instead of simply connecting a single chip to a motherboard, advanced packaging brings multiple chips or chiplets together in highly optimized ways, enabling faster communication, smaller form factors, and dramatically better performance.

In simple terms, Advanced Packaging is the “glue” and “architecture” that make modern multi-chip and chiplet-based systems possible.

Related Articles

• Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection
• Advanced Packaging and Chiplets Can Be for Everyone
• High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
• Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
• Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

Related Products

• Interconnect Chiplet
• 100G optical I/O chiplets
• HBM3e Advanced-packaging chiplet for all workloads

Related Blogs

• The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
• Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
• Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO
• Semiconductors supply chain ecosystem for advanced packaging
• TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design

Related News

• “From Lab to Fab” – Innovative front-end and advanced packaging technologies for the semiconductor value chain
• Chiplet Summit 2026 to Spotlight AI Acceleration and Advanced Packaging
• Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
• PGC Integrates 2.5D/3D Advanced Packaging Technology to Break the “Memory Wall” and Accelerate AI/HPC ASIC Innovation
• YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier