Chiplet
A chiplet is a small, modular piece of a larger computer chip. Instead of building one big, complex processor as a single unit (called a monolithic chip), chip designers now split it into several smaller chips—chiplets—and connect them together to work as one powerful system.
Why Chiplets Matter
Chiplets have become essential in modern semiconductor design because they solve many problems that come with producing extremely advanced processors. As chips become smaller and more complex, creating one large chip becomes expensive and difficult. Chiplets offer a smarter, more flexible alternative.
Why Chiplets Are the Future
The semiconductor industry is quickly moving toward chiplet-based architectures because they offer better scalability, reduced costs, and improved power efficiency. As technology advances, chiplets make it possible to build more powerful and energy-efficient electronics—from smartphones to supercomputers.
Related Articles
- 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
- Chiplet technology for large-scale trapped-ion quantum processors
- Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism
- Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect
- Towards Future Microsystems: Dynamic Validation and Simulation in Chiplet Architectures
Related Blogs
- Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace
- The Growing Chiplet Ecosystem: Collaboration, Innovation, and the Next Wave of UCIe Adoption
- From Spec to Silicon: Successful Physical AI System Chiplet Bring-Up
- A look back at the Automotive Chiplet Forum 2025
- Accelerating an Open Chiplet Ecosystem for Automotive with Foundation Chiplet System Architecture
Featured Content
- 聯電取得imec iSiPP300矽光子技術授權 布局下世代高速通訊
- 创新协作,合见工软与北京芯力共筑芯粒技术产业新生态
- 创意电子与AyarLabs携手推进超大规模运算的Co-PackagedOptics技术
- 领先的AI基础设施供应商选择YES为其玻璃基板AI与HPC应用提供全系列先进封装工具
- YES獲得一流記憶體供應商的多筆VeroTherm™和VeroFlex™系統訂單
- 破局 AI 算力困局:3D-IC 技术架构的颠覆性变革
- Resonac創設27家企業組成的「JOINT3」聯盟以開發下一代半導體封裝技術
- 创意电子 (GUC) 正式加入 NVIDIA NVLink Fusion 生态系统
- Arteris将为AMD新一代AI芯粒设计提供FlexGen智能片上网络 (NoC) IP
- CoAsia SEMI與Rebellions聯手基於REBEL架構共同開發新一代AI芯粒
- GUC 业界领先的 TSMC SoIC-X 专用 UCIe Face-up IP 完成投片
- Arteris推出全新Magillem Packaging解决方案应对IP模块与芯粒的硅设计复用挑战
- Arteris 推出升级版 Multi-Die 解决方案,加速 AI 驱动芯片创新
- 智原科技公佈2025年第一季財務報告
- HyperLight利用其TFLN Chiplet ™ 平台推出创下Vπ新低纪录的110GHz强度调制器