Open Compute Project - Chiplet Ecosystem

The Open Compute Project (OCP) is a collaborative community focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure.

What's New

Accelerating Early-Stage explorations with Virtual Prototyping for a thriving multi-vendor chiplet ecosystem

Open Compute Project Enables Silicon Diversity in AI Clusters

Enabling a true open ecosystem for 3D IC design

Compression Enabled MRAM Memory Chiplet Subsystems for LLM Inference Accelerators

D2D Chiplet Based SiP Testing Challenges and Solutions

Open Compute Project Foundation and JEDEC Drive Open Silicon Innovation

From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology

Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems

BoW PHY 2.1

Addressing the Colossal Challenge of System Co-Optimization with a Holistic Chiplet Design Methodology

Standards for Chiplet Design with 3DIC Packaging - Part 2

Standards for Chiplet Design with 3DIC Packaging (Part 1)

Open Compute Project

Corporate Headquarters

Open Compute Project
13785 Research Blvd, Suite 125
Austin TX 78750
USA