Open Chiplet Economy – Chapter II

By Bapi Vinnakota Ph.D., Open Domain-Specific Architecture Project Lead, OCP
Cliff Grossner Ph.D., Chief Innovation Officer at OCP

Chiplets have arrived as the way to design very large chips at leading-edge nodes. But how can we take full advantage of the drop-in approach they offer, allowing designers to easily include existing designs at older nodes, IP, and chiplets from outside sources? The OCP believes that an open chiplet economy is the way to go. It will serve the needs of chiplet creators, ASIC designers, and those providing support such as design tools, test facilities, and professional services. Such an economy requires standards, tools, and best practices. The OCP is already pursuing projects that standardize design models, help establish 3rd party testing, improve supply chain methods, define best practices for assembly, and create a standard high- performance, low-power die-to-die interface. The open chiplet economy will benefit large and small organizations alike, and will create huge opportunities for economic growth worldwide.

Introduction
Chiplets Will be Everywhere Chips Are
For Open Chiplet Economy…
…Need New Integration Across The Value Chain
Delivered By a New Open Chiplet Economy
Open Chiplet Economy Driven By OCP
Everybody is Welcome to Participate
Significant Progress Made
All the Way to Real Products
What Next?
Here is what we would do today
Because Standards Permit Many Bandwidth vs. Bump Density Tradeoffs …
… But Every Chiplet in a SiP Makes The Same Energy/Bit and Reach Trade-off
An truly Open Chiplet Economy needs Guardrails
Modularity Provides Guardrails
1st We Chipletize into Standardized Modules
Then We Create a Family of Variants
Please Join Us and Help Grow the Open Chiplet Economy
Conclusion