GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
By Galib Ibne Haidar, Kimia Zamiri Azar, Hadi M Kamali, Mark Tehranipoor, Farimah Farahmandi
University of Florida, USA
A heterogeneous integrated system in package (SIP) system integrates chiplets outsourced from different vendors into the same substrate for better performance. However, during post-integration testing, the sensitive testing data designated for a specific chiplet can be blocked, tampered or sniffed by other malicious chiplets. This paper proposes GATE-SiP which is an authenticated partial encryption protocol to enable secure testing. Within GATE-SiP, the sensitive testing pattern will only be sent to the authenticated chiplet. In addition, partial encryption of the sensitive data prevents data sniff threats without causing significant penalties on timing overhead. Extensive simulation results show the GATE-SiP protocol only brings 6.74% and 14.31% on area and timing overhead, respectively.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Technical Papers
- Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
- Enabling Innovative Multi-Vendor Chiplet-Based Designs
- Fault Modeling, Testing, and Repair for Chiplet Interconnects
- Reliability challenges in 3D IC semiconductor design
Latest Technical Papers
- MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging
- ATSim: A Fast and Accurate Simulation Framework for 2.5D/3D Chiplet Thermal Design Optimization
- Chiplet-Based Architectures: Redefining the Future of System-on-Chip (SoC) Design
- AuthenTree: A Scalable MPC-Based Distributed Trust Architecture for Chiplet-based Heterogeneous Systems
- THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures