What's a Chiplet ? Why Now ?
The Ojo-Yoshida Report began a five-episode videocast, “Dig Deeper on Chiplets,” in November.
One more episode (“China Goes for Chiplets") remains to go on air. In the meantime, however, to help our audience catch up, we held a wrap-up session with the series’ host Ron Wilson, our Technology Editor.
The promise of chiplets has taken the industry by storm. But as we have maintained, a host of technical challenges remains, with serious questions about how the emerging ecosystem around 2.5D and 3D integration might disaggregate the semiconductor industry landscape as we know it. Is this a threat or an opportunity?
Based on the video interviews in our five "Dig Deeper" episodes, Junko Yoshida and Bolaji Ojo join Ron Wilson, to compare notes, discuss what we’ve learned, and look forward to learning more in our upcoming 2024 Season Two.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Arm Defines a New Standard for Chiplet Interoperability
- China Target Chiplet, will it be a shortcut for China semiconductor self sufficiency？
- China's Chiplet Revolution: A Game Changer in Semiconductor Industry
- Why chiplet will transform the semiconductor ecosystem from design to packaging?
Latest Videos
- Optical Connectivity At 224 Gbps
- Proximity is all You Need – Two Tricks for Chiplet Interconnects
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
- Mick Posner talks about the importance of UCIe
- Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP