Emerging Chiplet Ecosystems Enable Innovative Multi-Vendor Designs
By Elad Alon, CEO, Blue Cheetah
Chiplets reduce the rising costs of innovation. Heterogeneous compute, especially AI applications, stands to gain the most from chiplet-based designs. System architects are discovering that the keys to successful chiplet integration are an application-appropriate ecosystem and a customizable die-to-die (D2D) interconnect tailored for their end applications.
Brought to you by SemIsrael
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Emerging Chiplet Ecosystems Enable Optimized Multi-Vendor Designs
- From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology
- Synopsys Keynote at Chiplet Summit 2025: Accelerating AI Chip Development with 3D Multi-Die Designs
- Compression Enabled MRAM Memory Chiplet Subsystems for LLM Inference Accelerators
Latest Videos
- Introducing the UCIe™ 3.0 Specification: Continued Innovations in the Open Chiplet Ecosystem
- From 2.5D to true 3D IC: What's driving the next wave of integration
- Packaging the Future of Semiconductors: Lim Choon Khoon on Chiplets, HBM, and Beyond
- Accelerate 3D IC designs with Innovator3D IC
- On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach