Data Routing In Heterogeneous Chip Designs
Ensuring data gets to where it's supposed to go at exactly the right time is a growing challenge for design engineers and architects developing heterogeneous systems. There is more data moving around these chips with dozens of targets, which makes routing signals much more complicated. Ronen Perets, senior product marketing manager at Cadence Design Systems, talks with Semiconductor Engineering about some of the new problems engineers are likely to encounter with multi-vendor chiplets, what can happen when communication is not consistent, and the impact of multiple communications links between each routing node.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Heterogeneous 2.5/3D Chip Design Requires Integrated Tools
- Paving the Road Ahead: RISC-V and Chiplet Technologies in Modern Automotive and Data Center Architectures
- Analyzing Packet Data Flow in Chiplet Based SoCs
- Synopsys Keynote at Chiplet Summit 2025: Accelerating AI Chip Development with 3D Multi-Die Designs
Latest Videos
- Advanced Packaging & Chiplet Design with Chipletz
- Integrated Photonics for the Next Generation of Glass Core Substrates
- Photonic Wire Bonding: Bridging the Gaps in Photonic Packaging
- Thermal Simulator for Advanced Packaging and Chiplet-Based Systems
- Cadence Chiplets Solutions: Helping you realize your chiplet ambitions