Chiplets & UCIe : Overview

This video is about chiplets and UCI Express, a new standard for communication between chiplets.

The video starts with a brief history of integrated circuits, explaining how they have become increasingly complex over time. This complexity has led to challenges in manufacturing and design, which chiplets aim to address.

Chiplets are individual functional blocks that can be manufactured by different foundries using different processes. They are then assembled into a single package to form a complete system. This approach offers several advantages, including:

Increased yield: By breaking down a complex chip into smaller chiplets, the yield of good dies is improved.
Design flexibility: Chiplets can be mixed and matched from different vendors, which gives designers more flexibility.
Performance and cost optimization: Chiplets can be manufactured using the most suitable process for their function, which can optimize performance and cost.
The video then discusses the challenges of chiplet integration, such as interoperability, testing, and verification. It also introduces UCI Express, an open standard that is being developed to address these challenges.

UCI Express is a high-speed, low-latency communication protocol that is specifically designed for chiplet-to-chiplet communication. It is based on the PCI Express protocol and is supported by a consortium of major industry players.

The video concludes with a brief overview of the UCI Express protocol stack and the different physical layer connections that can be used to connect chiplets.

Overall, this video provides a good introduction to chiplets and UCI Express. It is a complex topic, but the video does a good job of explaining the basics in a clear and concise way.

• Origins and Rise of Integration:
• Evolution of Packaging Technology 
• Chiplets
• Transition from Monolithic integration to Heterogeneous Integration 
• Connections to Chiplets
• Challenges and Solutions: Heterogeneous Integration:
• Challenges and Solutions: Die-to-Die (D2D) Interfaces:
• Types of chiplet Protocols:
• UCIe Vs PCIe
• A list of interconnect standards used for data transfer
• UCIe layering
• UCIe PHY
• Serdes Tx and IOs 
• Serdes Receivers