TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
By Trendforce (September 5, 2024)
Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips.
According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, TSMC will use the A16 advanced process to manufacture the chiplets, and integrated them with 12 HBM4, which is expected to be launched in 2027.
Reportedly, in his speech at the Semicon Taiwan 2024 “3D IC / CoWoS for AI Summit,” He noted that the global semiconductor market is projected to become a trillion-dollar industry by 2030, with HPC and AI being the key drivers, accounting for 40% of the market, which also make AI chips crucial drivers for 3D IC packaging.
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