Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
By Majeed Ahmad, EDN | August 18, 2025
While the Silicon 100 report was being compiled and curated to profile the most promising startups in the semiconductor industry in 2025, two prominent chiplet upstarts were already taken. First, Qualcomm announced its acquisition of chiplet interconnect developer Alphawave Semi in the second week of June 2025.
Nearly a month later, Tenstorrent snapped Blue Cheetah Analog Design, another supplier of die-to-die interconnect IPs. These two deals highlight the red-hot nature of the chiplets world and how this new multi-die technology landscape is emerging despite geopolitical headwinds.
In this year’s Silicon 100 report, there are eight startup companies associated with chiplet design and manufacturing work. In the chiplet design realm, DreamBig Semiconductor develops chiplet platforms and high-performance accelerator solutions for 5G, artificial intelligence (AI), automotive, and data center markets. Its core technology includes a chiplet hub with high-bandwidth memory (HBM).
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Athos Silicon Selects DreamBig Semiconductor’s Chiplet Hub™ for its Safety-Critical mSoC™ Platform Designed Ground-up for Autonomy
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
Latest News
- Asicland Marks First Anniversary of ‘Taiwan R&D Center’
- Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems
- Ayar Labs and Alchip to Scale AI Infrastructure with Co-Packaged Optics
- Alchip 3DIC Test Chip Tape Out Validates Ecosystem Readiness
- BOS Semiconductors Introduces the Industry’s First Chiplet-Based NPU Samples, Expanding Supply to Global Automotive OEMs