NTT looks to 15Tbit/s chiplet optical interconnects
NTT in Japan has set up a subsidiary to develop a short range 15Tbit/s optical transceiver for chiplet interconnects.
By Nick Flaherty, eeNews Europe (March 18, 2024)
The co-packaged optical and electronic technologies being developed by NTT Innovative Devices (ID) are aimed at combining photonic and electronic hardware in the data centre and in devices, including smartphones.
The roadmap for the Innovative Optical and Wireless Network (IOWN) initiative, NTT’s next-generation communications and computing infrastructure, has three elements: an all-photonics network, digital twin computing and the Cognitive Foundation.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
- Intel Demonstrates First Fully Integrated Optical I/O Chiplet
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
Latest News
- NHIZ promotes chiplet industry's development and cooperation
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- Breaking the Memory Wall: How d-Matrix Is Redefining AI Inference with Chiplets
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Intel moves to chiplets for automotive AI