NAPMP announces chiplets R&D area

By Pradeep Chakraborty, Pradeep’s TechPoints (November 5, 2024)

At the recently-held CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Proposer’s Day, an R&D area was chiplets.

Bapiraju Vinnakota, NAPMP Program Manager​, stated that the key date for submitting concept papers for chiplets was Dec. 20, 2024. Invitation for full application submission will be on a later date.

Today, the industry is moving toward chiplets. Chiplets are a small, functionally targeted semiconductor chip that, when assembled at tight pitch and placement, results in a highly functional subsystem. A single product integrates and assembles multiple chiplets connected to one another through die-to-die interfaces.

The motivation behind chiplets is to build big (reticle busters), build fast (modularity, reuse), build better (optimize function to process node). A chiplets / systems design inflection point is enabled by advanced packaging. Tomorrow’s packages will be more like chips.

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