NAPMP announces chiplets R&D area
By Pradeep Chakraborty, Pradeep’s TechPoints (November 5, 2024)
At the recently-held CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Proposer’s Day, an R&D area was chiplets.
Bapiraju Vinnakota, NAPMP Program Manager, stated that the key date for submitting concept papers for chiplets was Dec. 20, 2024. Invitation for full application submission will be on a later date.
Today, the industry is moving toward chiplets. Chiplets are a small, functionally targeted semiconductor chip that, when assembled at tight pitch and placement, results in a highly functional subsystem. A single product integrates and assembles multiple chiplets connected to one another through die-to-die interfaces.
The motivation behind chiplets is to build big (reticle busters), build fast (modularity, reuse), build better (optimize function to process node). A chiplets / systems design inflection point is enabled by advanced packaging. Tomorrow’s packages will be more like chips.
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