Is Chiplets the Answer to the End of Moore’s Law?
By Pritam Bordoloi, AnalyticsIndiaMag (September 6, 2024)
Chiplets offer greater flexibility and scalability in semiconductor design by allowing the integration of smaller, specialised components into a single package.
Is Moore’s Law dead? Many would argue–yes. Yet, this is not the end of the advancement in the semiconductor realm. We have just entered the age of generative AI, and the requirement for newer and more efficient chips is ever-growing. Many in the industry believe chiplets could be the answer.
Read more at: https://analyticsindiamag.com/ai-origins-evolution/is-chiplets-the-answer-to-the-end-of-moores-law/
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- The keeper of Moore’s Law
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- This Chinese city wants to be the Silicon Valley of chiplets
- Chiplets: Piecing Together the Next Generation of Chips (Part I)
Latest News
- Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
- Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
- ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
- OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA