Is Chiplets the Answer to the End of Moore’s Law?
By Pritam Bordoloi, AnalyticsIndiaMag (September 6, 2024)
Chiplets offer greater flexibility and scalability in semiconductor design by allowing the integration of smaller, specialised components into a single package.
Is Moore’s Law dead? Many would argue–yes. Yet, this is not the end of the advancement in the semiconductor realm. We have just entered the age of generative AI, and the requirement for newer and more efficient chips is ever-growing. Many in the industry believe chiplets could be the answer.
Read more at: https://analyticsindiamag.com/ai-origins-evolution/is-chiplets-the-answer-to-the-end-of-moores-law/
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Alphawave Semi to Reveal Ecosystem and Key Architectures Unlocking Generative AI Potential at EE Times' "Chiplets: Building the Future of SoCs" Seminar
- The keeper of Moore’s Law
- How the Worlds of Chiplets and Packaging Intertwine
- Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future
Latest News
- Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
- Test & Yield Challenges of Chiplet-Based Semiconductor Products
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line