This Chinese city wants to be the Silicon Valley of chiplets
By Zeyi Yang, MIT Technology Review (February 7, 2024)
Wuxi, the Chinese center of chip packaging, is investing in chiplet research to enhance its role in the semiconductor industry.
Outside China, chiplets are one of the alternative routes that the semiconductor industry could take to improve chip performance cost-effectively. Instead of endlessly trying to cram more transistors into one chip, the chiplet approach proposes that the functions of a chip can be separated into several smaller devices, and each component could be easier to make than a powerful single-piece chip. Companies like Apple and Intel have already made commercial products this way.
But within China, the technology takes on a different level of significance. US sanctions mean that Chinese companies can’t purchase the most advanced chips or the equipment to make them, so they have to figure out how to maximize the technologies they have. And chiplets come in handy here: if the companies can make each chiplet to the most advanced level they are capable of and assemble these chiplets into a system, it can act as a substitute for more powerful cutting-edge chips.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- SKC invests in Chipletz, a rising star of the U.S. chip packaging industry
- JCET’s Automotive Chip Advanced Packaging Flagship Factory Project Gains Momentum
- Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
Latest News
- Global Zeus and PulseForge Introduce Fully-Automated Photonic Debonder
- ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility
- Back-End Packaging And Test: From Lessons Learned To Future Innovations
- Developing the Framework of Chiplet Economy with Nandan, Baya Systems
- Lam Research Ushers in New Era of Semiconductor Metallization with ALTUS® Halo for Molybdenum Atomic Layer Deposition