Imec’s Van den hove: Moving to Chiplets to Extend Moore’s Law
By Pat Brans, EETimes Europe (April 3, 2024)
Imec’s Luc Van den hove is a respected point person on applied research across the semiconductor industry, both on imec’s home turf in Belgium and in Europe as a whole.
President and CEO of imec since July 2009, Luc Van den hove began his career in 1984, when he joined imec to start research in the field of silicide and interconnect technologies. Author or co-author of more than 200 published papers, Van den hove is a respected point person on applied research across the semiconductor industry, both on imec’s home turf in Belgium and in Europe as a whole. “Interdisciplinary collaboration will be imperative to solve the complex tasks ahead,” Van den hove said, and toward that end, imec “[bridges] the gap from lab to fab, from academic research to industry-relevant R&D.”
EE Times Europe: What are the big application areas for semiconductors today and in the near future? What are their requirements and what trends are they driving in the industry?
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Are Chiplets Enough to Save Moore's Law?
- Is Chiplets the Answer to the End of Moore’s Law?
- Chiplets: Piecing Together the Next Generation of Chips (Part I)
- Chiplets: Piecing Together the Next Generation of Chips (Part II)
Latest News
- Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
- Test & Yield Challenges of Chiplet-Based Semiconductor Products
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line