Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
By Ed Sperling and Ann Mutschler, Semi Engineering (January 30th, 2025)
The migration from monolithic SoCs to chiplet-based designs is creating a confusing array of options and tradeoffs for design teams working at the leading edge, and the number of choices is only going to increase as third-party chiplets begin pouring into the market.
That hasn’t dampened the appetite for chiplets, however, which are deemed essential for future generations of semiconductors for several reasons.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures
- Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance
- Intel Unveils Chiplet Alliance To Enable New Chip Designs
- Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line
Latest News
- IEEE Study Achieves Efficient Integration of Quantum Dot Lasers on Silicon Chiplets
- Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Infinitesima Metron®3D 300mm System Released for In-line Process Control by Leading DRAM Manufacturer
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree