Intel Unveils Chiplet Alliance To Enable New Chip Designs
The group will help pave the way towards a new class of chips
By Mark LaPedus, Semiecosystem | May 13, 2025
At its recent foundry conference, Intel officially announced the formation of a new group that will help propel the development of a technology called chiplets.
The new group, called the Chiplet Alliance, includes Intel, Ansys, Arm, Cadence, Siemens, Synopsys and others. The group will help pave the way towards a new class of chip designs using the chiplets approach.
Basically, chiplets are small modular dies or chips, which have a specific function. The dies, or chiplets, are connected and then combined in a package, creating a completely new and more complex chip (See image below). This approach is a fast and low-cost way to develop complex chips, but there are several challenges to develop them.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Draper Joins Intel Foundry Chiplet Alliance to Support Development of Interoperable and Secure Chiplet Solutions
- QuickLogic Joins Intel Foundry Chiplet Alliance
- ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
Latest News
- TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say
- Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- JCET Advances High-Aspect-Ratio TSV Technology for 2.5D and 3D Packaging
- Semiconductor Research Corporation Launches SPARC, Accelerating Industry-Driven University Research for the Next Generation of Semiconductor Innovation