Intel Unveils Chiplet Alliance To Enable New Chip Designs
The group will help pave the way towards a new class of chips
By Mark LaPedus, Semiecosystem | May 13, 2025
At its recent foundry conference, Intel officially announced the formation of a new group that will help propel the development of a technology called chiplets.
The new group, called the Chiplet Alliance, includes Intel, Ansys, Arm, Cadence, Siemens, Synopsys and others. The group will help pave the way towards a new class of chip designs using the chiplets approach.
Basically, chiplets are small modular dies or chips, which have a specific function. The dies, or chiplets, are connected and then combined in a package, creating a completely new and more complex chip (See image below). This approach is a fast and low-cost way to develop complex chips, but there are several challenges to develop them.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Draper Joins Intel Foundry Chiplet Alliance to Support Development of Interoperable and Secure Chiplet Solutions
- QuickLogic Joins Intel Foundry Chiplet Alliance
- Intel patents chiplet GPU design
- ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility
Latest News
- ASML, Mistral AI enter strategic partnership
- EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
- Asicland Marks First Anniversary of ‘Taiwan R&D Center’
- Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems
- Ayar Labs and Alchip to Scale AI Infrastructure with Co-Packaged Optics