2.5D Integration: Big Chip Or Small PCB?
By Brian Bailey, Semi Engineering (February 29th, 2024)
The industry is divided about the right materials, methodologies, and tools for interconnecting chiplets, and that can cause problems.
Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it can have significant consequences for the overall success of a design.
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