UCIe and Automotive Electronics: Pioneering the Chiplet Revolution
The automotive industry stands at the brink of a profound transformation fueled by the relentless march of technological innovation. Gone are the days of the traditional, one-size-fits-all system-on-chip (SoC) design framework. Today, we are witnessing a paradigm shift towards a more modular approach that utilizes diverse chiplets, each optimized for specific functionalities. This evolution promises to enhance the automotive system’s flexibility and efficiency and revolutionize how vehicles are designed, built, and operated.
At the heart of this transformation lies the Universal Chiplet Interconnect Express (UCIe), a groundbreaking standard introduced in March 2022. UCIe is designed to drastically simplify the integration process across different chiplets from various manufacturers by standardizing die-to-die connections. This initiative caters to a critical need within the industry for a modular and scalable semiconductor architecture, thus setting the stage for unparalleled innovation in automotive electronics.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Blogs
- The Need for Chiplets, and UCIe in Automotive
- UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
- Marvell Joins Imec Automotive Chiplet Initiative to Facilitate Compute SoCs for Super-human Sensing
- 4 takeaways from the 2nd automotive chiplet conference
Latest Blogs
- Why Electrical Design Matters in Chiplet Architectures – Part One: Signal Integrity and Power Delivery
- A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution
- Let’s Get Serious: TeraPHY™ Optical Engine Passes the Test for AI Scale-Up at Volume
- Accelerating Early-Stage explorations with Virtual Prototyping for a thriving multi-vendor chiplet ecosystem
- Arteris’ Multi-Die Solution for the RISC-V Ecosystem