4 takeaways from the 2nd automotive chiplet conference
On October 10 and 11, 2023, the automotive ecosystem convened at imec to talk about what’s now routinely called ‘the chiplet challenge.’ Here are four takeaways from those two days.
1. Chiplets are on everyone’s radar
The number of participating companies had risen from 30 to 50 compared to the first installment of the automotive chiplet conference. It’s safe to say all these people didn’t fly in to enjoy the Belgian autumn weather. They were there because chiplets are a hot topic in the industry.
One participant said, “The question is not if but when chiplets will enter the automotive market.”
It’s a matter of logic: next-level ADAS and in-vehicle infotainment (IVI) features will require compute performance levels that are on par with those of data centers or high-end consumer devices. And these markets have already moved to chiplets.
Everyone agreed that chiplets will be a part of future cars, no matter what. That means the industry now has a window of opportunity to steer this inevitable evolution jointly.
Because if standards can be established, OEMs can mix and match chiplets from different, sometimes niche, semiconductor players. That will fuel innovation and make the supply chain more diverse and resilient.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Blogs
- Three Key Takeaways from the First Annual Chiplet Summit
- Chiplet Integration in the Automotive Realm
- The Chiplet Center of Excellence sets new standards for the automotive industry
- 3 Key Takeaways from Chiplet Summit 2025
Latest Blogs
- Chiplets and Dielets: Coexisting Technologies in Heterogeneous Integration
- Accelerating Physical AI Through Cadence Silicon Solutions and Arm Total Design
- SoC and NoC in the Chiplet Era: Understanding Modern SoC Architecture
- From Chiplet Design to Physical Reality: Why AI Hardware Needs Continuous Engineering Intelligence
- Beyond the Die Boundary: How Arteris Multi-Die Technology Is Redefining AI System Design