Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical 10% with each new node. This, combined with the physical limits of silicon, makes traditional scaling increasingly unviable. This reality is driving the need for new approaches, with chiplet-based architectures emerging as a solution.
The chiplet-based approach offers significant advantages, including modularity for faster and cost-effective design, customization for meeting specific performance and power needs, improved yield by reducing complexity, optimized power and performance through tailored IP integration, and scalability that allows for seamless upgrades without full-chip redesigns.
Boyd Phelps, Senior VP and GM, Silicon Solutions Group, Cadence, gave a keynote presentation at the Chiplet Summit 2025 conference. His talk addressed how the industry is embracing the chiplet journey, the driving factors for rapid adoption, and how Cadence is bringing value to its customer base.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Blogs
- Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI
- UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall
- Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
- Lowering the Barrier to Chiplets
Latest Blogs
- AMI Outlines Full Support for Arm Total Design Chiplet Architecture to Custom Silicon Designers and Producers at APAC ATD Summit
- Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)
- Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance
- UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration
- Foundry 2.0 – the New Path Forward for Moore’s Law