System-in-Package (SiP)

System-in-Package (SiP) is a cutting-edge semiconductor packaging technology that integrates multiple chips and passive components into a single compact module. SiP enables high functionality, miniaturization, and optimized performance, making it ideal for smartphones, wearables, IoT devices, automotive electronics, and high-performance computing applications.

What Is System-in-Package (SiP)?

System-in-Package (SiP) is a technology that combines multiple integrated circuits (ICs), passive components, and interconnects into one package. Unlike traditional multi-chip modules, SiP uses advanced 3D stacking or side-by-side layouts to achieve a smaller footprint, better performance, and lower power consumption.

SiP allows engineers to build highly integrated systems without the cost and complexity of creating a single large monolithic chip.

Related Articles

• Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration
• High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
• System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution
• REED: Chiplet-based Accelerator for Fully Homomorphic Encryption
• Chiplet-Based Techniques for Scalable and Memory-Aware Multi-Scalar Multiplication

Related Blogs

• Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace
• What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts
• Introduction to Chiplets: Why the Industry is Moving Beyond Monolithic Designs
• The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier
• Streamlining Functional Verification for Multi-Die and Chiplet Designs