Hybrid Bonding

Hybrid Bonding is an advanced semiconductor packaging technology that connects two chips—or layers of a chip—directly at both the metal and dielectric level. Unlike traditional solder-based connections, Hybrid Bonding creates ultra-dense, ultra-low-resistance bonds that allow chips to communicate faster, use less power, and fit into more compact designs.

In simple terms, Hybrid Bonding is like “gluing” chips together at the microscopic level with extreme precision, creating a nearly seamless electrical connection.

Related Articles

• Hybrid Bonding With Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography
• Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review
• Revamping the Semiconductor Industry with Hybrid Bonding
• Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding
• Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications

Related Blogs

• 3D-IC Packaging: Wafer Stacking, Hybrid Bonding, and Interposer/RDL Techniques
• The Future of Faster, Smaller, and More Efficient Chips: A Breakthrough in Hybrid Bonding
• 2024 Forecast: Hybrid Bonding Steps Up
• Thermal Management in 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies
• Through-Silicon Vias (TSVs): Interconnect Basics, Design Rules, and Performance

Related News

• Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding Toward High-Volume Manufacturing
• EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025
• EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
• YMTC’s Hybrid Bonding Patents: A Key Competitive Factor for Memory Chipmakers
• EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025