2.5D Integration

2.5D Integration is an advanced semiconductor packaging technique that places multiple chips or chiplets side-by-side on a high-performance interposer, allowing them to communicate at extremely high speeds. It’s called “2.5D” because it offers many of the benefits of full 3D stacking—such as high bandwidth and lower power—without requiring chips to be stacked directly on top of each other.

In simple terms, 2.5D Integration is like placing several powerful chips on one ultra-fast “circuit board” made of silicon or other materials, enabling them to work together as a unified system.

Related Articles

• Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect
• HALO: Memory-Centric Heterogeneous Accelerator with 2.5D Integration for Low-Batch LLM Inference
• ChipletPart: Scalable Cost-Aware Partitioning for 2.5D Systems
• Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
• STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration

Related Blogs

• What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts
• Introduction to Chiplets: Why the Industry is Moving Beyond Monolithic Designs
• From Blocks to Systems: Understanding Chiplets in SoC Design
• Why Electrical Design Matters in Chiplet Architectures – Part One: Signal Integrity and Power Delivery
• Arteris’ Multi-Die Solution for the RISC-V Ecosystem

Related News

• imec: New Methods for 2.5D and 3D Integration
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
• Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape
• What’s Missing In 2.5D EDA Tools