Interconnect & IO Chiplet

Interconnect & IO Chiplet enable high-bandwidth, low-latency communication between compute, memory, and external systems in modern heterogeneous architectures. As system performance increasingly depends on data movement efficiency, these chiplets form the backbone of scalable multi-die platforms.

This category includes SerDes, die-to-die interconnect, high-speed electrical IO, and optical / photonic chiplets, supporting standards such as UCIe, PCIe, CXL, Ethernet, and emerging optical interfaces. Interconnect & IO chiplets are essential for AI accelerators, HPC systems, and data center platforms requiring massive bandwidth, interoperability, and power efficiency.

Designed for advanced packaging technologies including 2.5D, 3D, co-packaged optics (CPO), and near-packaged optics (NPO), these chiplets enable modular system design and flexible integration across vendors and process nodes. Interconnect & IO chiplets are a key enabler of next-generation AI factories and disaggregated computing architectures.