Die-to-Die (D2D) Interconnect Chiplet-Ready IP
Die-to-Die (D2D) Interconnect Chiplet-Ready IP enable high-bandwidth, low-latency communication between dies within a package. They are essential for scalable chiplet-based architectures that rely on fast and efficient on-package data movement.
D2D chiplets support standards such as UCIe and proprietary interfaces, enabling multi-vendor interoperability and modular system design.
All offers in
Die-to-Die (D2D) Interconnect
Chiplet-Ready IP
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Chiplet-Ready IP
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FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- 10x productivity boost
- Expert-level results
- Wire length reduction-driven performance
- Chiplet ready, multi-die interconnect
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Ncore Multi-Die Interconnect IP
- Scale Performance with Multi-Die Coherency
- Increase Bandwidth and Reduce Latency
- Tune Systems for Flexibility and Design Requirements
