Die-to-Die (D2D) Interconnect Chiplet-Ready IP

Die-to-Die (D2D) Interconnect Chiplet-Ready IP enable high-bandwidth, low-latency communication between dies within a package. They are essential for scalable chiplet-based architectures that rely on fast and efficient on-package data movement.

D2D chiplets support standards such as UCIe and proprietary interfaces, enabling multi-vendor interoperability and modular system design.

This category is currently being populated.
New Chiplet-Ready IP products will be added shortly as the ecosystem continues to expand.

Chiplet-Ready IP vendors: if you have a solution aligned with this category, we welcome you to submit your product description for review and inclusion.