Interconnect & IO Chiplet-Ready IP
Interconnect & IO Chiplet-Ready IP enable high-bandwidth, low-latency communication between compute, memory, and external systems in modern heterogeneous architectures. As system performance increasingly depends on data movement efficiency, these chiplets form the backbone of scalable multi-die platforms.
This category includes SerDes, die-to-die interconnect, high-speed electrical IO, and optical / photonic chiplets, supporting standards such as UCIe, PCIe, CXL, Ethernet, and emerging optical interfaces. Interconnect & IO chiplets are essential for AI accelerators, HPC systems, and data center platforms requiring massive bandwidth, interoperability, and power efficiency.
Designed for advanced packaging technologies including 2.5D, 3D, co-packaged optics (CPO), and near-packaged optics (NPO), these chiplets enable modular system design and flexible integration across vendors and process nodes. Interconnect & IO chiplets are a key enabler of next-generation AI factories and disaggregated computing architectures.
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High Performance Droplet
- High-Performance Analog Front-Ends (AFEs): Essential for data acquisition and signal processing in various applications.
- High-Speed Interfaces: Facilitating seamless communication between solutions. Omni Design supports various standards, including JESD204 and PCIe.
- Custom Solutions: Omni Design can tailor SoC solutions to meet specific customer requirements.
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100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
