Optical IO / Photonic Chiplet
Optical IO / Photonic Chiplet enable data transmission using light, delivering extremely high bandwidth and energy efficiency compared to electrical interconnects. They are increasingly used in AI data centers to overcome electrical scaling limits.
These chiplets support architectures such as co-packaged optics (CPO) and near-packaged optics (NPO), enabling scalable optical connectivity adjacent to compute.
All offers in
Optical IO / Photonic
Chiplet
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5
Chiplet
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5)
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DPIQ Tx PICs
- Reliable & qualified
- Patented ultra-low drive voltage design
- > 110 GHz electro-optic bandwidth
- Low total optical insertion loss
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IMDD Tx PICs
- Reliable & qualified
- Supports single or dual input laser to drive all 8-channels
- CMOS-level drive voltage, featuring our patented ultra-low drive voltage design
- > 110 GHz electro-optic bandwidth
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Near-Packaged Optics (NPO) Chiplet Solution
- CPO/NPO connectivity for GPU/Switch/ASIC with integrated OSPic™ all-optical signal processor
- High capacity, low latency up to 10Tbps for scale out CPO
- From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
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100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
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High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports