Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects
October 13, 2025
Chiplet Technical Papers
Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
October 13, 2025
On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach
October 9, 2025
3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems
October 9, 2025
Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package
October 6, 2025
HALO: Memory-Centric Heterogeneous Accelerator with 2.5D Integration for Low-Batch LLM Inference
October 6, 2025
Chiplet-Based RISC-V SoC with Modular AI Acceleration
September 25, 2025
Near-energy-free photonic Fourier transformation for convolution operation acceleration
September 23, 2025
Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
September 15, 2025
Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
September 13, 2025
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
September 8, 2025
MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging
August 29, 2025
ATSim: A Fast and Accurate Simulation Framework for 2.5D/3D Chiplet Thermal Design Optimization
August 29, 2025
Chiplet-Based Architectures: Redefining the Future of System-on-Chip (SoC) Design
August 22, 2025
AuthenTree: A Scalable MPC-Based Distributed Trust Architecture for Chiplet-based Heterogeneous Systems
August 20, 2025
THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures
August 19, 2025
LaZagna: An Open-Source Framework for Flexible 3D FPGA Architectural Exploration
August 18, 2025
Corsair: An In-memory Computing Chiplet Architecture for Inference-time Compute Acceleration
August 11, 2025
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
August 6, 2025
Chiplets Are The New Baseline for AI Inference Chips
August 5, 2025
