Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim
November 4, 2025
Chiplet Technical Papers
CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems
October 31, 2025
Taming the Tail: NoI Topology Synthesis for Mixed DL Workloads on Chiplet-Based Accelerators
October 30, 2025
Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs
October 29, 2025
Towards Future Microsystems: Dynamic Validation and Simulation in Chiplet Architectures
October 29, 2025
Self-Attention to Operator Learning-based 3D-IC Thermal Simulation
October 29, 2025
Open Chiplet Architecture
October 29, 2025
DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design
October 23, 2025
LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration
October 21, 2025
3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
October 20, 2025
Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects
October 13, 2025
Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
October 13, 2025
On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach
October 9, 2025
3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems
October 9, 2025
Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package
October 6, 2025
HALO: Memory-Centric Heterogeneous Accelerator with 2.5D Integration for Low-Batch LLM Inference
October 6, 2025
Chiplet-Based RISC-V SoC with Modular AI Acceleration
September 25, 2025
Near-energy-free photonic Fourier transformation for convolution operation acceleration
September 23, 2025
Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
September 15, 2025
Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
September 13, 2025