Corsair: An In-memory Computing Chiplet Architecture for Inference-time Compute Acceleration
August 11, 2025
Chiplet Technical Papers
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
August 6, 2025
Chiplets Are The New Baseline for AI Inference Chips
August 5, 2025
Hybrid Bonding With Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography
August 4, 2025
Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging
August 4, 2025
Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and Beyond
August 2, 2025
A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration
July 31, 2025
ChipletPart: Scalable Cost-Aware Partitioning for 2.5D Systems
July 29, 2025
Chiplet design basics for engineers
July 28, 2025
Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
July 18, 2025
Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review
July 16, 2025
Resister: A Resilient Interposer Architecture for Chiplet to Mitigate Timing Side-Channel Attacks
July 14, 2025
Quantum Dot DBR Lasers Monolithically Integrated on Silicon Photonics by In-Pocket Heteroepitaxy
July 11, 2025
AuxiliarySRAM: Exploring Elastic On-Chip Memory in 2.5D Chiplet Systems Design
July 3, 2025
System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution
July 2, 2025
Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration
June 24, 2025
Fault Modeling, Testing, and Repair for Chiplet Interconnects
June 24, 2025
Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
June 19, 2025
Heterogeneous Integration Brings Compound Semiconductors into the Age of RF CMOS
June 16, 2025
Chiplet basics: Separating hype from reality
June 16, 2025
