Chiplet Technical Papers

Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging

By Taejoon Noh, Sungkyunkwan University

November 24, 2025

Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism

By Cong Wang, The Hong Kong University of Science and Technolog

November 21, 2025

Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond

By Paul Scheffler, ETH Zurich

November 20, 2025

Sangam: Chiplet-Based DRAM-PIM Accelerator with CXL Integration for LLM Inferencing

By Khyati Kiyawat, University of Virginia

November 18, 2025

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

By Emad Haque, Arizona State University

November 17, 2025

3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence

By Eren Kurshan, Princeton University

November 14, 2025

Mastering multi-physics effects in 3D IC design

By Todd Burkholder, Siemens EDA

November 10, 2025

PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration

By Yue Jiet Chong, National University of Singapore

November 7, 2025

Optimizing Attention on GPUs by Exploiting GPU Architectural NUMA Effects

By Mansi Choudhary, Duke University

November 6, 2025

Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect

By Tai Yan, Beihang University

November 5, 2025

Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim

By Wajid Ali, University of Engineering and Technology

November 4, 2025

CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems

By Lukas Pfromm, University of Wisconsin–Madison

October 31, 2025

Taming the Tail: NoI Topology Synthesis for Mixed DL Workloads on Chiplet-Based Accelerators

By Arnav Shukla, Indraprastha Institute of Information Technology

October 30, 2025

Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs

By Junhyeok Park, Electronics and Telecommunications Research Institute

October 29, 2025

Towards Future Microsystems: Dynamic Validation and Simulation in Chiplet Architectures

By Shailesh Chouhan, Luleå University of Technology

October 29, 2025

Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

By Zhen Huang, University of Science and Technology of China

October 29, 2025

Open Chiplet Architecture

By Open Chiplet Architecture

October 29, 2025

DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design

By Xinling Yu, University of California

October 23, 2025

LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration

By Tiantian Lin, Zhejiang University

October 21, 2025

3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

By Janak Sharda, Georgia Institute of Technology

October 20, 2025